TeraSpatial develops AI-first, dual-use wireless infrastructure software and hardware that solves the data-movement bottleneck in AI systems. Founded in 2022, the company combines breakthrough RF silicon with embedded AI/ML at the physical layer to deliver up to 10× more capacity and lower latency than legacy wireless—at a fraction of the cost and deployment time of fiber.
AI is being stranded at the edge. As GenAI expands across distributed and edge infrastructures, the real barrier is not the sensors or devices themselves — it’s the transport layer that moves massive data streams between edge sites and the cloud. Traditional backhaul — slow, costly fiber builds or static wireless links capped at tens of Mbps—cannot keep up with the demands of AI training, visualization, or digital twin.
The problem is most acute in environments that are mobile (fleets of autonomous vehicles, UAVs, defense missions), temporary (construction sites, forward bases, live events), or unpredictable (disaster recovery, emergency response, pop-up networks) — where connectivity must be high-capacity, rapidly deployable, and resilient.
TeraSpatial solves this with a dual approach: breakthrough hardware delivering multi-Gbps xHaul and AI-driven software that models, predicts, and optimizes connectivity inside customer networks, making them adaptive and robust. This combination removes the transport bottleneck and enables AI to scale — anywhere, anytime.
